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1.4.11 In-Circuit Test (ICT) Since the process temperature for most lead-frees are higher than for eutectic- or near-eutectic Sn-Pb solder, any flux residues associated with No-Clean soldering are more thoroughly baked onto PWB surface metals. This inhibits electrical test probe contact. Even with today s No-Clean solder pastes and with Sn-Pb solders, electrical probing can be a challenge. Often the residues that cover test points necessitate multiple seating cycles of the test probes to penetrate the flux residue.

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How to Generate Code 128 Barcode in RDLC Reports
RDLC reports, created by the Visual Studio ReportViewer control based on Report Definition Language Client Side, are local reports and completely run in local ...

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The relative benefits of removing or reducing lead remain controversial Some studies have shown a net negative effect due to the energy materials and processes required for the production and use of replacement lead-free materials Whatever the long-term environmental impact, the short-term consequences clearly create a technical challenge to ensure reliable, costeffective printed circuit assemblies There are neither drop-in replacements for Sn-Pb solder nor industry wide consensus for a single-solder alloy The alloys that are most promising have significant challenges due to raw materials pricing, limited reliability data, and yet-to-be-determined interactions with other materials It has taken many years to understand the properties of Sn-Pb solder, its metallurgical behavior, solder joint properties, and soldering methodologies Any new solders will have to undergo scrutiny to determine key characteristics of process and reliability.

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Step 1: For the Basic of RDLS report follow this link: Create RDLC report. Step 2: Download the bar code font 3 of 9 from this site: Barcode Font.

multiplexer which selects one of the many clock sources for the timer/counter. The prescaler for both the timer/counter0 and the timer/counter1 are illustrated in Figure 3.35. The 8-Bit Timer/Counter0 block diagram is illustrated in Figure 3.36. The 8-bit Timer/Counter0 can select clock source from CK, prescaled CK, or an external pin. In addition, it can be stopped using the control bits in the Timer/Counter0 Control Register TCCR0. The overflow status flag is found in the Timer/Counter Interrupt Flag Register TIFR. Control signals are found in the Timer/Counter0 Control Register TCCR0. The interrupt enable/disable settings for Timer/Counter0 are found in the Timer/Counter Interrupt Mask Register TIMSK. When Timer/Counter0 is externally clocked, the external signal is synchronized with the oscillator frequency of the CPU. To ensure proper sampling of the external clock, the minimum time between two external clock transitions must be at least one internal CPU clock period. The external clock signal is sampled on the rising edge of the internal CPU clock. The 8-bit Timer/Counter0 features both a high-resolution and a high-accuracy usage with the lower prescaling opportunities. (Figure 3.37.)

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Since the paradigm for characterizing solders and reliability has been honed through the millennia-long use of Sn-Pb solder, the development cycle for Pb-free solder should be significantly streamlined On the other hand, the rapid changeover to Pb-free solder brings with it risks with regard to process effectiveness and control, as well as the longterm reliability of the end product These risks will require continuous reevaluations of the solder alloy choice, appropriate surface finishes, soldering conditions, materials compatibility (PWB, IC packages, and such), redefinition of solder volume requirements for reliable solder joint strength, and even some equipment changesAs a result, the Chap 45 on Solder Materials contains a detailed discussion of lead-free alloys and materials and offer several choices on materials and discussion of their characteristics.

Since nearly all the practical Pb-free alloy choices have a higher melting temperature, a requisite higher energy consumption and energy cost is associated with the new soldering materials Equipment changes needed for Pb-free processing will be discussed in Chaps 46 and 47 Also, as Pb-based solder will remain in use until at least 2010 as per RoHS, another likely mode of failure will be the inadvertent use of Pb-free solder with Pb d packages or Pb d solder with Pb-free packages Although there is some backward and forward compatibility in terms of solders, packages, and surface finishes, there are also some difficulties Some packages meant for use in the Pb d process will not tolerate the higher soldering temperatures associated with most Pb-free solders.

Fig 64: Classification of rolling element bearings based on the shape of the rolling element [5]

In the case of a Pb-free ball grid array (BGA) soldered with Pb d solder, or vice versa, it is already known that there will be a negative impact to the resultant solder joint reliability for the leading Pb-free candidate solders Increased tensile strength with increased brittleness is commonly reported for the tin-silver-copper system a leading replacement candidate China, Japan, and Korea have legislative initiatives taking shape that are similar to the EU s, WEEE, and RoHS directives This is the case for several US states also There is no escaping the fact that Pb-free soldering will be the mainstay of all future electronics interconnections..

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