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Metallographic Cross-Sectioning8,9 A method for cross-sectioning PC boards is as follows: 1. Bulk cutting. Remove a manageable-sized piece of board or assembly by shearing or abrasive cutting. 2. Precision cutting. Perform low-speed sawing with a diamond wafer blade to produce vertical sections about 1 1.2 in., and cut a horizontal section next to PTH pads. 3. Mounting. Encapsulate sections vertically and horizontally in epoxy resin. 4. Fine grinding. Hand-grind using 240-, 320-, 400-, and 600-grit silicon carbide papers. 5. Rinsing. Rinse the sample between grits. 6. Polishing. Diamond-polish (6 mm) on nylon cloth and alumina polishing (0.3 mm) on nap cloth using a rotating wheel.To polish the sample, place it on the rotating-wheel polisher and move it slowly in the opposite direction. Polish for 4 min. if using a 6 mm diamond on nylon, and 1 min. on 0.3 mm alumina on nap cloth. Clean and dry between polishing compounds. 7. Etching. Apply a cotton swab for 2 to 5 sec., soaked in a solution of equal parts of ammonium hydroxide and 3 percent hydrogen peroxide. Rinse in water and dry carefully. 8. Documenting. Observe and photograph the sample with a microscope at 30 to 1500 magnification.

Hull Cell Although the advanced techniques discussed previously provide precise control of plating solutions, Hull cell testing is still widely used in the industry. Its advantages are low cost, simplicity of operation, and its actual correlation with plating production. Its main disadvantage

The timer in the AVR controller can function as a timer or a counter. As a timer, the internal clock signal or a derivative of that clock signal is used to clock the timer, while as a counter, an external signal on a port pin is used to clock the timer/counter. Figure 3.35 illustrates the

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eutectic will mean significantly higher manufacturing materials costs. Also, during wave soldering, the molten and flowing wave will tend to dissolve certain surface finishes, which may eventually build up and change the composition of the solder alloy. Different solder alloys have different metals dissolution properties. Therefore, using the same lead-free solder alloy for wave soldering as for reflow may be impractical. Some of the overt costs and impacts of moving to lead-free solders were mentioned previously in this chapter. There are other potentially hidden costs. Soldering equipment may not have the bandwidth to handle the higher temperatures of some of the pb-free alloys. Reflow ovens may need to be constructed out of different materials to handle long-term effects of the higher temperatures. Fan bushings and polymeric seals to maintain inert atmosphere integrity may not withstand much above the temperature regimes required for Sn-Pb processing. These same considerations apply to wave soldering. Hand soldering irons will require higher temperatures, and more boards will likely have to be scrapped due to localized charring while trying to attain reflow during the hand soldering operation or at repair. Board materials, fluxes, and such may require reformulating, which is also likely to drive costs higher.

Fig 63: Classification of rolling element bearings based on the direction of the applied load [5]

1.4.7 Equipment Changes In some cases, soldering equipment changes are required to accommodate higher process temperatures and contact with materials other than Sn and Pb. Such changes are discussed in more detail in Chap. 47.

1.4.8 Scrapping and Material Mistakes There will be costs associated with segregating materials (Pb d versus Pb-free) and associated increased floor space for carrying two inventories (Pb d and Pb-free). Noncompliant materials will have to be scrapped or sold off to those still using leaded processes. It is anticipated that in the early throes of the conversion to Pb-free, parts inventories occasionally will be inadvertently mixed, which may impact finished goods reliability and also make these products unacceptable for import to Europe after July 1, 2006, due to tenets of the RoHS directive.

1.4.9 Training Every facet of manufacturing is touched by this change, whether it is the soldering process, solder joint inspection, electrical testing, material inventories, bill-of-materials verification, purchase specifications, inventory separation, and incoming materials inspection. The adaptations of RoHS and Pb-free standards for printed circuit assembly certainly require the most extensive changes that the electronics industry has ever needed to make. Great care has to go into training of personnel at every level of printed circuit assembly (PCA) building and support.

1.4.10 Reliability Testing The change of materials and solders to accommodate the elimination of Pb necessitates reliability testing of the Pb-free assemblies to ensure that reliability is comparable to that of Sn-Pb assemblies. Reliability test methods, parameters, and models will have to be refined to match material properties of Pb-free assemblies.

Spherical (Barrel)

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